top of page

Job Code | #550

Senior Packaging/Assembly Engineer


Taiwan, China

Job Overview:

Do you enjoy working in a creative fast-growing entrepreneurial environment? With indie you´ll never walk alone! We place high value on our teams and pursue excellence for our employees and customers!

indie is an Autotech solutions innovator. We focus on edge sensors spanning multiple modalities including LiDAR, radar, ultrasound and vision for Advanced Driver Assistance Systems (ADAS), autonomous vehicles, connected car, user experience and electrification applications.

This position will perform thermal and possible mechanical simulations on semiconductor packages and assemblies as well as support packaging and assembly activities from new product design through long-term sustained production. This will require communication and coordination across global internal teams ie: Marketing, Design, Applications, Test, Quality, Assembly Engineering, and Operations as well as external suppliers.

A successful applicant will have 7+ years experience in semiconductor IC packaging and assembly, strong technical trouble-shooting skills, high self-motivation, and attention to detail. English proficiency (written and verbal) is needed for efficient global team and vendor communications. International travel may be required

Job Responsibilities:

  • Perform thermal and possible mechanical simulations on semiconductor packages, customer boards, and module assemblies. Identify areas of risk, develop, and propose solutions.

  • Standardize simulation processes, build archive of standardized models and reports

  • Build and maintain materials database

  • Work with internal teams to build physical models of end-use assemblies to compare simulation results to actual. This will require 3D design of modules, 3D printing, system assembly, and transient analysis

  • Work with internal teams and vendors to optimize package designs, create DOE's, and analyze results to optimize package reliability to meet performance requirements

  • Aid in resolution of packaging and assembly processing issues via CAD modeling, technical research, lab setups etc.

  • Create all package CAD models and supporting documentation for datasheet and manufacturing use including package outline drawings, solder stencil, board land drawings, bonding diagrams, mark and BOM specifications, assemblies, and maintain archives

  • Support package qual activities, transfer to mass production, and sustaining production as needed

  • May involve international travel to indie and vendor sites

  • Training will be provided on CAD systems if needed

Job Requirements:

With us, you must love being part of an organization where everyone makes a difference and contributes to the company's success. Creativity, Ownership and Excellence are what we value.

These are the skills and know how an ideal candidate would bring. We understand that nobody is perfect! After all, your new job should challenge you and you should have the possibilities to grow.

  • Experience in high volume IC package design, assembly, and SMT processes

  • Understanding of heat transfer modes and mechanical stresses

  • Autocad 2D proficiency

  • 3D modeling experience, any platform

  • Understanding of linear and geometric tolerancing

  • Use of and adherence to document management, revision control

  • Flexibility to support range of design and operations activities across global teams and vendors

  • Excellent communication and problem solving skills. Self-motivated/proactive & detail-oriented

Preferred Qualifications

  • Heat transfer simulation experience using Flotherm and/or Flotherm XT

  • Understanding of FEA simulation methods

  • 7+ years of high volume IC package design and manufacturing experience

  • Project management and schedule planning via Gannt


Human Resource Department

Telephone: 949-608-0854

bottom of page