Optimized Mixed Signal SiPs for Automotive

indie specializes in mixed-signal System-In-Package (SiP) solutions for automotive applications. Our SiP solutions integrate advanced digital ICs (MCU and/or DSP) with mixed-signal devices into a single package, optimizing performance and improving reliability while reducing space, power and cost.

Digital Die

• MCU, DSP, Flash, SRAM

• Serial or Parallel I/F

• Advanced Process Node

 Mixed Signal   Die 

 Digital 
 Die 

Mixed Signal Die

• Application Specific Blocks, Interfaces, Convertors, HV, PM Blocks, I/Os,

• Serial or Parallel I/F

• Mature Process Node

Innovative Interconnect

• Can be optimized for highest performance or lowest cost

• Serial or parallel depending on MCU core

• Software transparent.

• Scalable MCU/DSP/Flash/SRAM on advanced digital process node

• Differentiated, proven Mixed Signal IP on optimal process node

• Proprietary interface between chips can be optimized for high performance (low latency) or lowest cost

• Transparent to software - programming model same as for single die

• Integrated power management with direct connection to VBat

• Better IP Protection, more difficult for competitors to benchmark

Side by Side Mounting​

• Reduced number of suppliers

• Reduced component count,  board space and usually fewer PCB layers

• Improved manufacturability & reliability vs. discrete solution

• Minimized power consumption

• Designed for lowest system cost

• Fast design time round due to re-use of proven IP and local technical support

• PPAP, AEC-Q100 qualification & IATF16949 manufacturing

Stacked Mounting​