Optimized Mixed Signal SiPs for Automotive
indie specializes in mixed-signal System-In-Package (SiP) solutions for automotive applications. Our SiP solutions integrate advanced digital ICs (MCU and/or DSP) with mixed-signal devices into a single package, optimizing performance and improving reliability while reducing space, power and cost.
Digital Die
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MCU, DSP, Flash, SRAM
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Serial or Parallel I/F
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Advanced Process Node

Mixed Signal Die
Digital
Die
Mixed Signal Die
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Application Specific Blocks, Interfaces, Convertors, HV, PM Blocks, I/Os,
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Serial or Parallel I/F
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Mature Process Node
Innovative Interconnect
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Can be optimized for highest performance or lowest cost
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Serial or parallel depending on MCU core
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Software transparent.
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Scalable MCU/DSP/Flash/SRAM on advanced digital process node
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Differentiated, proven Mixed Signal IP on optimal process node
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Proprietary interface between chips can be optimized for high performance (low latency) or lowest cost
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Transparent to software - programming model same as for single die
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Integrated power management with direct connection to VBat
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Better IP Protection, more difficult for competitors to benchmark


Side by Side Mounting
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Reduced number of suppliers
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Reduced component count, board space and usually fewer PCB layers
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Improved manufacturability & reliability vs. discrete solution
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Minimized power consumption
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Designed for lowest system cost
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Fast design time round due to re-use of proven IP and local technical support
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PPAP, AEC-Q100 qualification & IATF16949 manufacturing
Stacked Mounting